半固化片 / Prepreg
导热系数
Thermal Conductivity
规格
Specification
压合厚度 / Cured thickness
流动度 / Resin Flow
um
%
1W/m.K
1080
80 ± 10
20 ± 10
100 ± 10
30 ± 10
可根据需求,提供其他厚度的粘结片 / We are also able to supply HA10P with other thickness.