特性/ Features
1.高Tg：≥170℃ （DSC），无卤素
High Tg：≥170℃ (DSC), Halogen free
2.低介电常数(Dk≤4.3, 10GHz)
Low Dk≤4.3
3.低介质损耗(Df≤0.012 10GHz)
Low Df≤0.014, 10GHz
4.优异的热性能，Td≥340℃
Excellent Thermal Resistance, Td≥340℃
5.低Z轴热膨胀系数
Low Z axis CTE
6.较低的吸水性，耐CAF性能好，高可靠性
Low water absorption, excellent anti-CAF, high reliability
7.无铅制程兼容
Compatible with Lead-free process
应用领域/ Applications
手机、电脑、背板、卡板、交换机、服务器、厚铜产品、汽车电子
Mobile phone, Computer, Backplanes, card board, Switch, Servers, Heavy copper product, Automobile electronics.
建议压制程式/ Suggest Press cycle
主要特性 / General properties
检测项目 Item | 单位 Unit | 检测条件 Test Condition | 规范值 Spec | 典型值 Typical Value | |
玻璃化转变温度Tg | ℃ | DSC | ≥170 | 175 | |
剥离强度 Peel Strength 1oz | N/mm | 288℃, 10S | ≥0.7 | 1.05 | |
热应力Thermal stress | S | 288℃, solder dip | ＞10 | 180 s No delamination | |
弯曲强度 Flexural Strength | N/mm2 | 经向 Warp | ≥415 | 550 | |
纬向Fill | ≥345 | 450 | |||
燃烧性Flammability | － | E 24/125 | UL94V-0 | V-0 | |
表面电阻Surface Resistivity | MΩ | After moisture | ≥1.0×104 | 3.54×108 | |
体积电阻Volume Resistivity | MΩ· cm | After moisture | ≥1.0×106 | 4.70×1010 | |
介电常数Dielectric Constant | － | 10GHZ C 24/23/50 | \ | 4.3 | |
介质损耗角正切Loss Tangent | － | 10GHZ C 24/23/50 | \ | 0.012 | |
耐电弧Arc Resistance | S | D 48/50＋D 0.5/23 | ≥60 | 130 | |
击穿电压Dielectric Breakdown | KV | D 48/50＋D 0.5/23 | ≥40 | 60 | |
吸水率Moisture Absorption | % | D 24/23 | ≤0.8 | 0.12 | |
热分解温度Td | ℃ | Weight Loss 5% | ≥340 | 371 | |
CTE Z-axis | Alpha 1 | ppm / ℃ | TMA | ≤60 | 42 |
Alpha 2 | ppm / ℃ | ≤300 | 240 | ||
50 - 260 ℃ | % | ≤3.0 | 2.45 | ||
T288(Unclad) | Min | TMA | ≥15 | ＞60 | |
Specimen thickness: 1.0mm
Specification sheet：IPC-4101E/130, is for your reference only
Explanation: C: Humidity conditioning D: Immersion conditioning distilled water E: Temperature conditioning