Glass transition temp.

2.4.25

DSC

℃

134

CTE,Z-axis

2.4.24

α1，TMA

ppm/℃

60

α2，TMA

ppm/℃

300

50~260℃，TMA

%

4.3

Decomposition Temp.

2.4.24.6

TGA

℃

310

T288

2.4.24.1

TMA,copper clad

min

2

Thermal stress

2.4.13.1

unclad

sec

>120

Water absorption

2.6.2.1

E-1/105+D-24/23

%

0.11

Peel Strength/18μm

2.4.8

as received

lb/in

7.5

after thermal stress

lb/in

7.5

Permittivity(RC50%)

2.5.5.9

C-24/23/50,1G

/

4.40

Loss tagent(RC50%)

2.5.5.9

C-24/23/50,1G

/

0.014

Volume resistivity

2.5.17.1

C-96/35/90

MΩ·cm

5.07*10⁹

Surface resistivity

2.5.17.1

C-96/35/90

MΩ

5.16*10⁷

Arc Resistance

2.5.1

D48/50+D0.5/23

sec

131

Dielectric Breakdown

2.5.6

D48/50+D0.5/23

kV

58

Flexural strength

Warp

2.4.4

as received

MPa

580

Fill

2.4.4

as received

MPa

485

Flame resistance

UL-94

A&E-24/125

/

V0

CTI

C-96/20/65

IEC-60112

Rating

PLC3