首页  >  热固性树脂体系  >  产品详情
HC298

FEATURES

Stable dielectric constant, Low loss

Low moisture absorption

Good PIM performance

Good cooper peel strength


APPLICATIONS

Base Station


GENERAL PROPERTIES

Item

Test Method

Unit

HC298

Dielectric Constant

IPC TM-650 2.5.5.5

/

2.98+/-0.05

Dissipation Factor

IPC TM-650 2.5.5.5

/

0.0029

TCDK

IPC TM-650 2.5.5.5

ppm /

40

PIM

700,1800,2600MHz

dBc

-160

Volume Resistivity

IPC TM-650 2.5.17.1

MΩ·cm

108

Surface Resistivity

IPC TM-650 2.5.17.1

108

Peel strength

IPC-TM-650 2.4.8

lb/inch

4.5

Thermal Conductivity

ASTM-D5470

W/m·K

0.40

Moisture Absorption

IPC TM-650 2.6.2.1A

%

<0.10

Td

IPC TM-650 2.4.24.6

>500

CTE (X)

IPC TM-650 2.4.24C

ppm /

17

CTE (Y)

IPC TM-650 2.4.24C

ppm /

18

CTE (Z)

IPC TM-650 2.4.24C

ppm /

50

 

PRODUCT SPECIFICATIONS

Thickness

Standard Size

Copper Foil

0.010"(0.254mm) ±0.001"

48"*42" (1219mmx1067mm)

36"*48" (914mmx1219mm)

18"*24" (457mmx610mm)

1/2 OZ (17μm)

1 OZ (35μm)

0.020"(0.508mm) ±0.0015"

0.030"(0.762mm) ±0.002"

0.060"(1.524mm) ±0.004"