FEATURES
High Tg: ≥180℃(TMA)
Low Dk: ≤3.7, 10GHz, RC54%
Low Df; ≤0.005, 10GHz, RC54%
Excellent thermal resistance,Td≥340℃
Low Z axis CTE
Low water absorption, excellent anti-CAF, high reliability
Compatible with Lead-free
APPLICATIONS
Server
Switch
Base station
Optical module
Millimeter wave radar for Automotive
High performance computing, etc
GENERAL PROPERTIES
Item | Test Condition | Unit | Spec | Typical value | ||
Glass Transition Temperature (Tg) | DSC | ℃
| N/A | N/A | ||
TMA | ≥170 | 180 | ||||
DMA | ≥200 | 208 | ||||
Peel Strength 1oz Very low profile copper | RTF | N/mm | ≥0.53 | 0.70 | ||
HVLP | As Received | N/mm | ≥0.53 | 0.85 | ||
Thermal stress | 288℃,solder dip | S | >10 | >180s No delamination | ||
Flexural Strength | LW | N/mm2
| ≥345 | 520 | ||
CW | ≥345 | 480 | ||||
Flammability | E 24/125 | MΩ | UL94V-0 | V-0 | ||
Surface Resistivity | After moisture | MΩ·cm | ≥1.0x105 | 1.56x108 | ||
Volume Resistivity | After moisture | - | 21.0x106 | 2.21x109 | ||
Dielectric Constant (Rc54%) | 10GHZ C 24/23/50 | - | ≤3.7 | 3.65 | ||
Loss Tangent(RC54%) | 10GHZ C 24/23/50 | S | ≤0.0050 | 0.0048 | ||
Arc Resistance | D 48/50+D 0.5/23 | KV | ≥60 | 125 | ||
Dielectric Breakdown | D 48/50+D 0.5/23 | % | ≥40 | 58 | ||
Moisture Absorption | D 24/23 | ℃ | ≤0.2 | 0.11 | ||
Td | Weight Loss 5% | ppm/℃ | ≥340 | 395 | ||
CTE in XY/Z Axis | Alpha1 | TMA | ppm/℃ | ≤45 | 40 | |
Alpha2 | ppm/℃ | ≤260 | 258 | |||
50 - 260°C | % | ≤3.0 | 2.5 | |||
T288(Unclad) | TMA | min | ≥15 | ≥120 | ||
T300(Unclad) | TMA | min | ≥2 | >60 | ||
u Specimen thickness :0.762mm
u Specification sheet:IPC-4101E/102，is for your reference only.
u Explanation: C: Humidity conditioning D: Immersion conditioning in distilled water
E: Temperature conditioning