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H190HF

FEATURES

High Tg, Halogen free

Low Loss

Excellent Thermal Resistance

Low Z axis CTE

Low water absorption, excellent anti-CAF, high reliability

Compatible with Lead-free process


APPLICATIONS

Switch

Server

Router

Measuring instrument


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Tg

DMA

210

227

Peel Strength 1oz HTE

288,10S

N/mm

≥0.7

1.0

Peel Strength 1oz RTF

Thermal stress

288,10S

N/mm

≥0.5

0.6

288, solder dip

S

>10

180s No delamination

Flexural Strength

Warp

N/m

≥415

535

Fill

≥345

485

Flammability

E 24/125

-

UL94V-0

V-0

Surface Resistivity

After moisture

≥1.0x104

2.72x108

Volume Resistivity

After moisture

MΩ·cm

≥1.0x106

4.81x109

Dielectric Constant

10GHZ C 24/23/50

-

\

3.9(SPDR RC50%)

Loss Tangent

10GHZ C 24/23/50

-

\

0.0055(SPDR RC50%)

Arc Resistance

D 48/50+D 0.5/23

S

≥60

135

Dielectric Breakdown

D 48/50+D 0.5/23

KV

≥40

65

Moisture Absorption

D 24/23

%

≤0.8

0.12

Td

Weight Loss 5%

≥340

395

CTE in XY/Z Axis

Alpha1

TMA

ppm/

≤60

42

Alpha2

ppm/

≤300

209

50 - 260°C

%

≤3.0

1.8

T288(Unclad)

TMA

min

≥15

>60

 

u  Specimen thickness :1.0mm

u  Specification sheet:IPC-4101E/130,is for your reference only.

u  Explanation: C: Humidity conditioning D: Immersion conditioning in distilled water

E: Temperature conditioning