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H175HFZ

FEATURES

High Tg, Halogen free

Middle Loss, Low Z axis CTE

Excellent thermal resistance

Low water absorption, excellent anti-CAF, high reliability

Compatible with lead-free process


APPLICATIONS

Mobile Phone, Computer

Backplane, Card Board

Switch, Server

Heavy Copper Product

Automobile Electronics


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Tg

DSC

≧170

180

TMA

≧170

184

DMA

≧200

210

Peel Strength 1oz HTE

288°C,10s

N/mm

0.7

1.15

Peel Strength 1oz RTF

288°C,10s

N/mm

s

0.7

0.85

Thermal Stress

288°C, solder dip

>10

180s No delamination

Flexural Strength

Warp

N/mm2

≧415

550

Fill

≧345

450

Flammability

E24/125

-

UL94V-0

V-0

Surface Resistivity

After moisture

≧1.0x104

3.54x108

Volume Resistivity

After moisture

·cm

≧1.0x106

4.70x1010

Dielectric Constant(RC50%)

10GHZ C 24/23/50

-

\

4.2

Loss Tangent(RC50%)

10GHZ C 24/23/50

-

\

0.010

Arc Resistance

D 48/50+D 0.5/23

S

≧60

130

Dielectric Breakdown

D 48/50+D 0.5/23

Kv

≧40

60

Moisture Absorption

D 24/23

%

≦0.8

0.10

Td

Weight Loss 5%

≧320

385

CTE in XY/Z Axis

Alpha 1

TMA

ppm

≦60

33

Alpha 2

ppm

≦300

194

50-260

%

≦3.0

1.8

T288(Unclad)

TMA

Min

≧15

>60

 

u  Specimen thickness: 1.0mm

u  Specification sheet:IPC-4101E/130, is for your reference only.

u  Explanation:C:Humidity conditioning

    D: Immersion conditioning distilled water.

    E: Temperature conditioninge