应用领域/ Applications
适用于汽车电子设备，电源电路板，多层铝基板等
Applications: Automotive electronic equipment, Power device , Multi-layers AL-substrate
主要特性 / General properties
检测项目 Item | 单位 Unit | 检测条件 Test Condition | 规范值 Spec | 典型值 Typical Value |
热导率 Thermal Conductivity | W/ m·K | ASTM D 5470 | ≥1.0 | 1.02 |
玻璃化转变温度Tg | ℃ | DSC | ≥110 | 120 |
剥离强度 1oz Peel Strength | N/mm | 288℃, 10S | ≥1.05 | 1.56 |
热应力 Thermal stress | S | 288℃,solder dip | ＞10 | 120s No delamination |
弯曲强度 Flexural Strength | N/mm2 | 经向 LW | ≥415 | 467 |
纬向CW | ≥345 | 412 | ||
燃烧性Flammability | － | E 24/125 | UL94V-0 | V-0 |
表面电阻 Surface Resistivity | MΩ | After moisture | ≥1.0×104 | 4.62×106 |
体积电阻 Volume Resistivity | MΩ·cm | After moisture | ≥1.0×106 | 3.76×107 |
耐电弧Arc Resistance | S | D48/50＋D0.5/23 | ≥60 | 128 |
击穿电压 Breakdown Voltage | KV | IPC-TM-650 2.5.6.2 D48/50＋D0.5/23 | ≥40 | 60 |
吸水率 Moisture Absorption | % | D24/23 | ≤0.5 | 0.35 |
CTI | V | IEC-60112 | ≥600 | 600 |
Specimen Thickness : 0.8mm ;
Explanation: C: Humidity conditioning;D:Immersion conditioning in distilled water ; E:Temperature conditioning ;